MediaTek has just announced the arrival of two new 6nm chipsets. The Chipsets are built on TSMC’s 6nm manufacturing process have the name of Dimensity 920 and Dimensity 810. They are the upgrade of the Dimensity 900 and Dimensity 800, respectively.

Both Chipsets have octa-core CPUs and support for Full HD+ displays with 120Hz screen refresh rate. According to the rumors Dimensity 920 and Dimensity 810 are intended for mid-range phones.

The Dimensity 920 has the powerful Cortex-A78 cores running at 2.5GHz with the Cortex-A55 ones clocked at 2GHz. In Dimensity 920, the GPU is a Mali-G68 MC4. MediaTek claimed that this chipset will offer up to 9% faster gaming performance over the Dimensity 900.

Also Check:- Samsung is developing 24Gb DDR5 Memory Chips

The Dimensity 920 supports LPDDR4x and LPDDR5 RAM. Also have the support of UFS 2.2 and UFS 3.1 storage. This upgrade will give Mobile manufactures to extra flexibility when it comes to manufacture the smartphone.

The Dimensity 920 supports Dual 5G SIM connectivity, VoNR service. Also include all the latest Wi-Fi standards, 2×2 MIMO and Bluetooth 5.2.

The Dimensity 810 chip offers a Cortex-A76 CPU cores clocked at 2.4GHz and Cortex-A55 power-efficient ones. It is the first 6nm Dimensity 800 series chip. This Chip again offers dual 5G stand-by mode. Dimensity 810 chip has a Mali-G57 MC2 GPU. This support for up to LPDDR4x RAM and UFS 2.2 storage.

Both Dimensity 920 and Dimensity 810 are expected to arrive in Smartphone industry in Q3 2021. If you want to get the latest International news or some Latest leaks. Then stay tuned with